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Toshiba Expands Line-up of e-MMC Version 5.1 Compliant Embedded NAND Flash Memory Modules
Support Command Queuing, Secure Write Protection Features
IRVINE, Calif., March 23, 2015 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of its JEDEC e-MMC Version 5.1 compliant embedded NAND flash memory products.
https://photos.prnewswire.com/prnvar/20150323/183972
Featuring support for command queuing and secure write protection, the modules integrate NAND chips fabricated with Toshiba's 15nm second generation process technology and are fully compliant with the latest e-MMC(TM [1]) standard. The new products are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices.
In October 2014, Toshiba launched the industry's first([2]) e-MMC products supporting all mandatory features of JEDEC e-MMC Version 5.1, which was officially issued by JEDEC on February 24, 2015. The new additions to the line-up support two optional features of e-MMC Version 5.1: command queuing and secure write protection.
The command queuing feature enables users to store multiple tasks in a queue, which are then performed in order of the user's preference to enhance performance. It improves the random read performance speed by up to 30 percent([3]) when compared to existing Toshiba products that do not have command queuing. This feature improves the user experience, allowing the simultaneous execution of multiple applications at the same time - a typical scenario for users of mobile devices such as smartphones and tablets.
The secure write protection feature expands the conventional write protect feature and protects important data stored in assigned, secure areas from being overwritten or erased by unauthenticated users.
"Toshiba has been supporting e-MMC Version 5.1 since it first came out last year for a wide variety of applications," noted Scott Beekman, director of managed NAND memory products for TAEC. "The addition of these optional Version 5.1 features further enhances our product offering, and points to Toshiba's continued leadership role in NAND flash and embedded memory solutions."
Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high density memory products.
Toshiba's new line-up of single-package embedded NAND flash memories includes densities from 16GB to 128GB. Each device integrates a controller to manage basic control functions for NAND applications. Sample shipments of the 16GB and 64GB products begin today, with additional densities (including 32GB and 128GB) to follow. For additional company and product information, please visit http://www.toshiba.com/taec/.
New Product Lineup
Product Name Capacity Category Package Mass Production
------------ -------- -------- ------- ---------------
THGBMHG7C2LBAIL 16GB Supreme 11.5x13x0.8mm 2Q, 2015 (Apr.-Jun.)
--------------- ---- ------- ------------- -------------------
THGBMHG8C4LBAIR 32GB 11.5x13x1.0mm 2Q, 2015 (Apr.-Jun.)
--------------- ---- ------------- -------------------
THGBMHG9C8LBAIG 64GB 11.5x13x1.2mm 2Q, 2015 (Apr.-Jun.)
--------------- ---- ------------- -------------------
THGBMHT0C8LBAIG 128GB 11.5x13x1.2mm 2Q, 2015 (Apr.-Jun.)
--------------- ----- ------------- -------------------
*In Toshiba e-MMC categories, "Supreme" represents products suited to high-end class applications.
Key Features
1. The JEDECe-MMC Version 5.1 compliant interface handles essential
functions, including writing block management, error correction and
driver software. It simplifies system development, allowing manufacturers
to minimize development costs and speed up time to market for new and
upgraded products. Additionally, new features([)(4)(]) standardized in
JEDECe-MMC Version 5.1, such as BKOPS control, Cache Barrier, Cache
Flushing Report and Large RPMB Write, are applied to the new products to
enhance usability.
2. The random read performance can be improved by up to 30 percent
(max.)([)(3)(]) by applying the "command queuing feature," one of the new
optional features of JEDECe-MMC Version 5.1.
3. Embedded in a system, the 128GB products can record up to 16.3 hours of
full spec high definition video and 39.7 hours of standard definition
video([)(5)(]).
Key Specifications
Interface JEDECe-MMC V5.1 standard
HS-MMC interface
--- ----------------
Capacity 16GB, 32GB, 64GB, 128GB
-------- -----------------------
Power Supply Voltage 2.7-3.6V (Memory core)
1.7V-1.95V, 2.7V-3.6V (Interface)
--- ---------------------------------
Bus Width x1, x4, x8
--------- ----------
Temperature Range -25 degrees C to +85 degrees C
----------------- ------------------------------
Package 153Ball FBGA
11.5mm x 13.0mm
--- ---------------
Notes
[1] e-MMC(TM) is a product category for a
class of embedded memory products built
to the JEDEC e-MMC Standard
specification and is a trademark of the
JEDEC Solid State Technology Association.
The latest JEDEC e-MMC Version 5.1
specification was officially issued by
JEDEC on February 24, 2015.
[2] As of October 2, 2014. Toshiba survey.
[3] Toshiba survey.
[4] "BKOPS control" is a function where the
host allows the device to perform
background operation when the device is
idle. "Cache Barrier" is a function that
controls when cache data is written to
the memory chip. "Cache Flushing Report"
is a function that informs the host if
the device's flushing policy is FIFO
(First In First Out) or not. "Large RPMB
write" is a function that enhances the
data size that can be written to the RPMB
area to 8KB.
[5] HD and SD are calculated at average bit
rates of 17Mbps and 7Mbps, respectively.
The products are labeled based on the
memory chip(s) it contains, not the
amount of memory capacity available for
data storage by the end user. Consumer-
usable capacity will be less due to
overhead data areas, formatting, bad
blocks, and other constraints, and may
also vary based on the host device and
application.
(For purposes of measuring memory capacity
in this context, 1GB = 1,073,741,824
bytes.)
*Read and write speeds are calculated as
1MB/s = 1,000,000bytes/s.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at http://www.toshiba.co.jp/index.htm.
© 2014 Toshiba America Electronic Components, Inc. All rights reserved.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
Editor's Note: Images available for download from: http://toshiba.semicon-storage.com/us/company/taec/news/2015/03/memory-20150323-1.html
MEDIA CONTACT: COMPANY CONTACT:
Dena Jacobson Rebecca Bueno
Lages & Associates Toshiba America Electronic Components, Inc.
Tel.: (949) 453-8080 Tel.: (949) 462-7885
dena@lages.com rebecca.bueno@taec.toshiba.com
Photo - http://photos.prnewswire.com/prnh/20150323/183972
SOURCE Toshiba America Electronic Components, Inc.
Photo:https://photos.prnewswire.com/prnh/20150323/183972
http://photoarchive.ap.org/
Toshiba America Electronic Components, Inc.
Web Site: http://www.toshiba.com/taec
Toshiba Expands Line-up of e-MMC Version 5.1 Compliant Embedded NAND Flash Memory Modules
Support Command Queuing, Secure Write Protection Features
IRVINE, Calif., March 23, 2015 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of its JEDEC e-MMC Version 5.1 compliant embedded NAND flash memory products.
https://photos.prnewswire.com/prnvar/20150323/183972
Featuring support for command queuing and secure write protection, the modules integrate NAND chips fabricated with Toshiba's 15nm second generation process technology and are fully compliant with the latest e-MMC(TM [1]) standard. The new products are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices.
In October 2014, Toshiba launched the industry's first([2]) e-MMC products supporting all mandatory features of JEDEC e-MMC Version 5.1, which was officially issued by JEDEC on February 24, 2015. The new additions to the line-up support two optional features of e-MMC Version 5.1: command queuing and secure write protection.
The command queuing feature enables users to store multiple tasks in a queue, which are then performed in order of the user's preference to enhance performance. It improves the random read performance speed by up to 30 percent([3]) when compared to existing Toshiba products that do not have command queuing. This feature improves the user experience, allowing the simultaneous execution of multiple applications at the same time - a typical scenario for users of mobile devices such as smartphones and tablets.
The secure write protection feature expands the conventional write protect feature and protects important data stored in assigned, secure areas from being overwritten or erased by unauthenticated users.
"Toshiba has been supporting e-MMC Version 5.1 since it first came out last year for a wide variety of applications," noted Scott Beekman, director of managed NAND memory products for TAEC. "The addition of these optional Version 5.1 features further enhances our product offering, and points to Toshiba's continued leadership role in NAND flash and embedded memory solutions."
Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high density memory products.
Toshiba's new line-up of single-package embedded NAND flash memories includes densities from 16GB to 128GB. Each device integrates a controller to manage basic control functions for NAND applications. Sample shipments of the 16GB and 64GB products begin today, with additional densities (including 32GB and 128GB) to follow. For additional company and product information, please visit http://www.toshiba.com/taec/.
New Product Lineup
Product Name Capacity Category Package Mass Production
------------ -------- -------- ------- ---------------
THGBMHG7C2LBAIL 16GB Supreme 11.5x13x0.8mm 2Q, 2015 (Apr.-Jun.)
--------------- ---- ------- ------------- -------------------
THGBMHG8C4LBAIR 32GB 11.5x13x1.0mm 2Q, 2015 (Apr.-Jun.)
--------------- ---- ------------- -------------------
THGBMHG9C8LBAIG 64GB 11.5x13x1.2mm 2Q, 2015 (Apr.-Jun.)
--------------- ---- ------------- -------------------
THGBMHT0C8LBAIG 128GB 11.5x13x1.2mm 2Q, 2015 (Apr.-Jun.)
--------------- ----- ------------- -------------------
*In Toshiba e-MMC categories, "Supreme" represents products suited to high-end class applications.
Key Features
1. The JEDECe-MMC Version 5.1 compliant interface handles essential
functions, including writing block management, error correction and
driver software. It simplifies system development, allowing manufacturers
to minimize development costs and speed up time to market for new and
upgraded products. Additionally, new features([)(4)(]) standardized in
JEDECe-MMC Version 5.1, such as BKOPS control, Cache Barrier, Cache
Flushing Report and Large RPMB Write, are applied to the new products to
enhance usability.
2. The random read performance can be improved by up to 30 percent
(max.)([)(3)(]) by applying the "command queuing feature," one of the new
optional features of JEDECe-MMC Version 5.1.
3. Embedded in a system, the 128GB products can record up to 16.3 hours of
full spec high definition video and 39.7 hours of standard definition
video([)(5)(]).
Key Specifications
Interface JEDECe-MMC V5.1 standard
HS-MMC interface
--- ----------------
Capacity 16GB, 32GB, 64GB, 128GB
-------- -----------------------
Power Supply Voltage 2.7-3.6V (Memory core)
1.7V-1.95V, 2.7V-3.6V (Interface)
--- ---------------------------------
Bus Width x1, x4, x8
--------- ----------
Temperature Range -25 degrees C to +85 degrees C
----------------- ------------------------------
Package 153Ball FBGA
11.5mm x 13.0mm
--- ---------------
Notes
[1] e-MMC(TM) is a product category for a
class of embedded memory products built
to the JEDEC e-MMC Standard
specification and is a trademark of the
JEDEC Solid State Technology Association.
The latest JEDEC e-MMC Version 5.1
specification was officially issued by
JEDEC on February 24, 2015.
[2] As of October 2, 2014. Toshiba survey.
[3] Toshiba survey.
[4] "BKOPS control" is a function where the
host allows the device to perform
background operation when the device is
idle. "Cache Barrier" is a function that
controls when cache data is written to
the memory chip. "Cache Flushing Report"
is a function that informs the host if
the device's flushing policy is FIFO
(First In First Out) or not. "Large RPMB
write" is a function that enhances the
data size that can be written to the RPMB
area to 8KB.
[5] HD and SD are calculated at average bit
rates of 17Mbps and 7Mbps, respectively.
The products are labeled based on the
memory chip(s) it contains, not the
amount of memory capacity available for
data storage by the end user. Consumer-
usable capacity will be less due to
overhead data areas, formatting, bad
blocks, and other constraints, and may
also vary based on the host device and
application.
(For purposes of measuring memory capacity
in this context, 1GB = 1,073,741,824
bytes.)
*Read and write speeds are calculated as
1MB/s = 1,000,000bytes/s.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at http://www.toshiba.co.jp/index.htm.
© 2014 Toshiba America Electronic Components, Inc. All rights reserved.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
Editor's Note: Images available for download from: http://toshiba.semicon-storage.com/us/company/taec/news/2015/03/memory-20150323-1.html
MEDIA CONTACT: COMPANY CONTACT:
Dena Jacobson Rebecca Bueno
Lages & Associates Toshiba America Electronic Components, Inc.
Tel.: (949) 453-8080 Tel.: (949) 462-7885
dena@lages.com rebecca.bueno@taec.toshiba.com
Photo - http://photos.prnewswire.com/prnh/20150323/183972
SOURCE Toshiba America Electronic Components, Inc.
Photo:https://photos.prnewswire.com/prnh/20150323/183972
http://photoarchive.ap.org/
Toshiba America Electronic Components, Inc.
Web Site: http://www.toshiba.com/taec