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Orbotech Enters Solder Mask Direct Imaging Segment with a New Family of Direct Imaging Solutions
New solutions to raise printed circuit board manufacturing throughput and quality performance standards in highly accurate imaging applications
YAVNE, Israel, November 5, 2015 /PRNewswire/ --
ORBOTECH LTD. [http://www.orbotech.com/search_results/eng ] (NASDAQ: ORBK), a leading
provider of process innovation technologies, solutions and equipment serving the global
electronics manufacturing industry, today announced the introduction of a new family of
Direct Imaging (DI) solutions for Printed Circuit Board (PCB) solder masks. Direct Imaging,
one of the methods utilized in imaging solder mask layers, is an increasingly important
segment, which Orbotech currently estimates to between $70M - $90M per annum. Orbotech's
new solutions, which include the Orbotech Diamond(TM) and the Nuvogo(TM) 1000, are
expected to accelerate and increase the overall quality and efficiency of PCB solder mask
production processes. The Orbotech Diamond DI system addresses the solder mask
manufacturing needs of the High Density Interconnect (HDI) and Multilayer board (MLB)
segments of the PCB industry by offering high power and throughput. Beta site testing by
three different customers in diverse geographical regions has resulted in orders from all
three PCB manufacturers. The Orbotech Nuvogo 1000 joins the field proven Nuvogo family of
products and brings high accuracy and industry leading Depth of Focus (DoF) to flexible
PCB solder mask and other precision applications.
"With the demand for smaller, sleeker and wearable electronics, today's manufacturers
require PCB flexible production solutions that enable them to produce compact,
high-quality and low-cost PCBs with multiple competitive features in quick turnaround
conditions" said Mr. Arik Gordon, Corporate Vice President and President of the PCB
Division at Orbotech Ltd. "Our new solder mask DI systems offer PCB manufacturers
effective tools that deliver high throughput and streamlined production by enabling a
unified workflow and a consistent user interface from patterning to solder mask, advancing
the quality of PCB volume production and ultimately increasing overall production yield."
Orbotech Solder Mask DI SolutionsÂ
Orbotech's DI systems are specially designed to handle the most challenging PCB
production applications. Most of the world's high-end PCBs used in smartphones are already
produced using Orbotech systems; and the new products announced today will introduce even
greater functionality to Orbotech's portfolio of DI systems. Throughput enhancement
features include a dual table mechanism for imaging speed optimization and flexible
scaling modes to ensure exceptional registration.
Orbotech Diamond DI SolutionÂ
- Utilizes high power light source for maximum throughput for common solder resist.
- Wide wavelength spectrums that further ensure best fit for conventional solder
resists.
Nuvogo 1000 DI SolutionÂ
- High Depth of Focus (DoF) for highest line quality on challenging topographies
- MultiWave Laser Technology simultaneously generates a dual wavelength beam for maximum
robustness on a wide range of solder and patterning resists.
- Fits demanding application such as Solder resist for Flex, and allows dual use for
patterning and SR exposure.
About Orbotech Ltd.Â
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the
manufacture of the world's most sophisticated consumer and industrial products throughout
the electronics and adjacent industries. The Company is a leading provider of yield
enhancement and production solutions for electronics reading, writing and connecting, used
by manufacturers of printed circuit boards, flat panel displays, advanced packaging,
micro-electro-mechanical systems and other electronic components. Virtually every
electronic device in the world is produced using Orbotech systems. For more information,
visit http://www.orbotech.com.
Cautionary Statement Regarding Forward-Looking StatementsÂ
Except for historical information, the matters discussed in this press release are
forward-looking statements within the meaning of the U.S. Private Securities Litigation
Reform Act of 1995. Â These statements relate to, among other things, future prospects,
developments and business strategies and involve certain risks and uncertainties. Â The
words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar
terms and phrases, including references to assumptions, have been used in this press
release to identify forward-looking statements. Â These forward-looking statements are made
based on management's expectations and beliefs concerning future events affecting Orbotech
and are subject to uncertainties and factors relating to Orbotech's operations and
business environment, all of which are difficult to predict and many of which are beyond
the Company's control. Â Many factors could cause the actual results to differ materially
from those projected including, without limitation, timing and extent of achieving the
anticipated benefits of the acquisition of SPTS; Orbotech's ability to effectively
integrate and operate SPTS's business, the timing, terms and success of any strategic or
other transaction, cyclicality in the industries in which the Company operates, the
Company's production capacity, timing and occurrence of product acceptance (the Company
defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on
mutually agreed terms, which, in some cases for bookings and backlog, may still be subject
to completion of written documentation and may be changed or cancelled by the customer,
often without penalty), fluctuations in product mix, worldwide economic conditions
generally, especially in the industries in which the Company operates, the timing and
strength of product and service offerings by the Company and each of its competitors,
changes in business or pricing strategies, changes in the prevailing political and
regulatory framework in which the relevant parties operate or in economic or technological
trends or conditions, including currency fluctuations, inflation and consumer confidence,
on a global, regional or national basis, the level of consumer demand for sophisticated
devices such as smartphones, tablets and other electronic devices, the timing for a
verdict in the ongoing appeal of the criminal matter and ongoing investigation in Korea,
the final outcome and impact of this matter, including its impact on existing or future
business opportunities in Korea and elsewhere, any civil actions related to the Korean
matter brought by third parties, including the Company's customers, which may result in
monetary judgments or settlements, expenses associated with the Korean matter, ongoing or
increased hostilities in Israel and other risks detailed in the Company's SEC reports,
including the Company's Annual Report on Form 20-F for the year ended December 31, 2014,
and subsequent SEC filings. The Company assumes no obligation to update the information in
this press release to reflect new information, future events or otherwise, except as
required by law.
Â
COMPANY CONTACTS:Â
Anat Earon-Heilborn   Â
Director of Investor Relations       Â
Orbotech Ltd. Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â
Tel: +972-8-942-3582 Â Â
Investor.relations@orbotech.com   Â
EmptyBreak:MARKERÂ
Tally Kaplan PoratÂ
Head of Corporate MarketingÂ
Orbotech Ltd.Â
Tel: +972-8-942-3603Â
Tally-Ka@orbotech.com Â
Â
Orbotech Ltd.
Orbotech Enters Solder Mask Direct Imaging Segment with a New Family of Direct Imaging Solutions
New solutions to raise printed circuit board manufacturing throughput and quality performance standards in highly accurate imaging applications
YAVNE, Israel, November 5, 2015 /PRNewswire/ --
ORBOTECH LTD. [http://www.orbotech.com/search_results/eng ] (NASDAQ: ORBK), a leading
provider of process innovation technologies, solutions and equipment serving the global
electronics manufacturing industry, today announced the introduction of a new family of
Direct Imaging (DI) solutions for Printed Circuit Board (PCB) solder masks. Direct Imaging,
one of the methods utilized in imaging solder mask layers, is an increasingly important
segment, which Orbotech currently estimates to between $70M - $90M per annum. Orbotech's
new solutions, which include the Orbotech Diamond(TM) and the Nuvogo(TM) 1000, are
expected to accelerate and increase the overall quality and efficiency of PCB solder mask
production processes. The Orbotech Diamond DI system addresses the solder mask
manufacturing needs of the High Density Interconnect (HDI) and Multilayer board (MLB)
segments of the PCB industry by offering high power and throughput. Beta site testing by
three different customers in diverse geographical regions has resulted in orders from all
three PCB manufacturers. The Orbotech Nuvogo 1000 joins the field proven Nuvogo family of
products and brings high accuracy and industry leading Depth of Focus (DoF) to flexible
PCB solder mask and other precision applications.
"With the demand for smaller, sleeker and wearable electronics, today's manufacturers
require PCB flexible production solutions that enable them to produce compact,
high-quality and low-cost PCBs with multiple competitive features in quick turnaround
conditions" said Mr. Arik Gordon, Corporate Vice President and President of the PCB
Division at Orbotech Ltd. "Our new solder mask DI systems offer PCB manufacturers
effective tools that deliver high throughput and streamlined production by enabling a
unified workflow and a consistent user interface from patterning to solder mask, advancing
the quality of PCB volume production and ultimately increasing overall production yield."
Orbotech Solder Mask DI SolutionsÂ
Orbotech's DI systems are specially designed to handle the most challenging PCB
production applications. Most of the world's high-end PCBs used in smartphones are already
produced using Orbotech systems; and the new products announced today will introduce even
greater functionality to Orbotech's portfolio of DI systems. Throughput enhancement
features include a dual table mechanism for imaging speed optimization and flexible
scaling modes to ensure exceptional registration.
Orbotech Diamond DI SolutionÂ
- Utilizes high power light source for maximum throughput for common solder resist.
- Wide wavelength spectrums that further ensure best fit for conventional solder
resists.
Nuvogo 1000 DI SolutionÂ
- High Depth of Focus (DoF) for highest line quality on challenging topographies
- MultiWave Laser Technology simultaneously generates a dual wavelength beam for maximum
robustness on a wide range of solder and patterning resists.
- Fits demanding application such as Solder resist for Flex, and allows dual use for
patterning and SR exposure.
About Orbotech Ltd.Â
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the
manufacture of the world's most sophisticated consumer and industrial products throughout
the electronics and adjacent industries. The Company is a leading provider of yield
enhancement and production solutions for electronics reading, writing and connecting, used
by manufacturers of printed circuit boards, flat panel displays, advanced packaging,
micro-electro-mechanical systems and other electronic components. Virtually every
electronic device in the world is produced using Orbotech systems. For more information,
visit http://www.orbotech.com.
Cautionary Statement Regarding Forward-Looking StatementsÂ
Except for historical information, the matters discussed in this press release are
forward-looking statements within the meaning of the U.S. Private Securities Litigation
Reform Act of 1995. Â These statements relate to, among other things, future prospects,
developments and business strategies and involve certain risks and uncertainties. Â The
words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar
terms and phrases, including references to assumptions, have been used in this press
release to identify forward-looking statements. Â These forward-looking statements are made
based on management's expectations and beliefs concerning future events affecting Orbotech
and are subject to uncertainties and factors relating to Orbotech's operations and
business environment, all of which are difficult to predict and many of which are beyond
the Company's control. Â Many factors could cause the actual results to differ materially
from those projected including, without limitation, timing and extent of achieving the
anticipated benefits of the acquisition of SPTS; Orbotech's ability to effectively
integrate and operate SPTS's business, the timing, terms and success of any strategic or
other transaction, cyclicality in the industries in which the Company operates, the
Company's production capacity, timing and occurrence of product acceptance (the Company
defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on
mutually agreed terms, which, in some cases for bookings and backlog, may still be subject
to completion of written documentation and may be changed or cancelled by the customer,
often without penalty), fluctuations in product mix, worldwide economic conditions
generally, especially in the industries in which the Company operates, the timing and
strength of product and service offerings by the Company and each of its competitors,
changes in business or pricing strategies, changes in the prevailing political and
regulatory framework in which the relevant parties operate or in economic or technological
trends or conditions, including currency fluctuations, inflation and consumer confidence,
on a global, regional or national basis, the level of consumer demand for sophisticated
devices such as smartphones, tablets and other electronic devices, the timing for a
verdict in the ongoing appeal of the criminal matter and ongoing investigation in Korea,
the final outcome and impact of this matter, including its impact on existing or future
business opportunities in Korea and elsewhere, any civil actions related to the Korean
matter brought by third parties, including the Company's customers, which may result in
monetary judgments or settlements, expenses associated with the Korean matter, ongoing or
increased hostilities in Israel and other risks detailed in the Company's SEC reports,
including the Company's Annual Report on Form 20-F for the year ended December 31, 2014,
and subsequent SEC filings. The Company assumes no obligation to update the information in
this press release to reflect new information, future events or otherwise, except as
required by law.
Â
COMPANY CONTACTS:Â
Anat Earon-Heilborn   Â
Director of Investor Relations       Â
Orbotech Ltd. Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â
Tel: +972-8-942-3582 Â Â
Investor.relations@orbotech.com   Â
EmptyBreak:MARKERÂ
Tally Kaplan PoratÂ
Head of Corporate MarketingÂ
Orbotech Ltd.Â
Tel: +972-8-942-3603Â
Tally-Ka@orbotech.com Â
Â
Orbotech Ltd.